Feature:

• HK-series are available to set chip-mounting machine.
• Packaging is by emboss taping.
• In case of using normal cream-soldering by reflow, land configuralation is flat and size more than 1.6 mm × 3.2 mm.
• Material : Brass
• Surface treatment :
  – HK-2-G Gold plated on nickel base.
  – HK-2-S Sn plated on nickel base.

Feature:

• HK-series are available to set chip-mounting machine.
• Suitable for small devices as the size is 2 × 1.25.
• Packaging is by emboss taping.
• In case of using normal cream-soldering by reflow, land configuralation is flat and size more than 2 mm × 1.3 mm.
• Material : Brass
• Surface treatment :
  – HK-3-G Gold plated on nickel ...

Feature:

• HK-series are available to set chip-mounting machine.
• Suitable for small devices as the size is extremely small 1.2 × 1.0.
• Shall be used by oscilloscope hooked inner hole.
• In case of using normal cream-soldering by reflow, land configuralation is flat and size more than 1.3 mm × 1.1 mm.
• Material : Brass
• Surface treatment :
  – ...

Feature:

• Coloved check teminal to beset on chip-mounting machine.
• Choice of 10 colors.
• Size : 2.5 × 3.0.
• In case of using normal cream-soldering by reflow, land configuralation is flat and size more than 1.25 mm × 2.5 mm.
• Stored in emboss tape.
• Applicable temperature -40 〜 +150℃ .

Material:

Pin: Phosphor bronze 0.2t
Resin part ...