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Feature:
- HK-series are available to set chip-mounting machine.
- Packaging is by emboss taping.
- In case of using normal cream-soldering by reflow, land configuralation is flat and size more than 1.6 mm × 3.2 mm.
- Material : Brass
- Surface treatment :
– HK-2-G Gold plated on nickel base.
– HK-2-S Sn plated on nickel base.
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Feature:
- HK-series are available to set chip-mounting machine.
- Suitable for small devices as the size is 2 × 1.25.
- Packaging is by emboss taping.
- In case of using normal cream-soldering by reflow, land configuralation is flat and size more than 2 mm × 1.3 mm.
- Material : Brass
- Surface treatment :
– HK-3-G Gold plated on nickel ...
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Feature:
- HK-series are available to set chip-mounting machine.
- Suitable for small devices as the size is extremely small 1.2 × 1.0.
- Shall be used by oscilloscope hooked inner hole.
- In case of using normal cream-soldering by reflow, land configuralation is flat and size more than 1.3 mm × 1.1 mm.
- Material : Brass
- Surface treatment :
– ...
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Feature:
- Coloved check teminal to beset on chip-mounting machine.
- Choice of 10 colors.
- Size : 2.5 × 3.0.
- In case of using normal cream-soldering by reflow, land configuralation is flat and size more than 1.25 mm × 2.5 mm.
- Stored in emboss tape.
- Applicable temperature -40 〜 +150℃ .
Material:
Pin: Phosphor bronze 0.2t
Resin part ...